Silicon Packaging Design Engineer

Job Description: Join our team as a Silicon Packaging Design Engineer in the Data Center Group, where you will play a pivotal role in crafting cutting-edge silicon packaging solutions that drive Intel's innovation and technological leadership. In this role, you will be engaged in the end-to-end development of substrate designs, from concept to tapeout, ensuring optimized performance and manufacturability. Collaborating closely with cross-functional teams, your contributions will directly impact product quality, cost efficiency, and time-to-market for Intel's next-generation technologies. This is an exciting opportunity to start your career in a collaborative environment that fosters learning and professional growth. Key Responsibilities - Drive the complete development of substrate designs, starting from initial concept through tapeout. - Perform physical layout and routing of package designs, ensuring adherence to design requirements. - Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost. - Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations. - Define and implement substrate design rules to meet product and manufacturing requirements. - Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs). - Integrate design documentation and collateral into the product lifecycle management system. - Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance. QUALIFICATIONS: Minimum Qualifications - Diploma in Electronic/ Electrical Engineering or a related field. - six months or more years of work experience in Semiconductor field related to design of silicon packaging or PCB. - Novice to intermediate proficiency in substrate design and development, including physical layout and routing. - Basic understanding of I/O fundamentals, package interconnect, and power delivery principles. - Familiarity with design for manufacturability (DFM) and quality assurance processes. - Strong problem-solving skills with a disciplined approach to execution. Preferred Qualifications -Preferred experience into E-CAD tool. - Effective communication skills to convey technical information and collaborate with cross-functional teams. - A proactive mindset to identify design improvement opportunities and ensure alignment with project goals. - Passion for driving innovation and contributing to complex engineering challenges. This is your opportunity to be part of Intel's legacy of innovation while developing your skills and advancing your career.