Sr. Hardware Engineer

Key Responsibilities Power Architecture & Conversion Design: Define hardware and power architecture; design SMPS, AC-DC and DC-DC converters across topologies (buck, boost, buck-boost, SEPIC, flyback, forward, LLC, push-pull). Add soft-start, current limiting, synchronous rectification, snubbers and EMI filters; select magnetics, MOSFETs, Ga N/Si C devices and gate drivers. Design battery systems — BMS, cell balancing, fuel gauging, USB-PD and Qi wireless charging. Perform loop compensation, Bode/stability analysis, transient response and thermal optimization. RF & Wireless Design: Design RF front-ends — LNAs, PAs, mixers, VCO/PLL and SAW/BAW/LC filters. Perform impedance matching, Smith chart / S-parameter analysis, link budget, sensitivity and phase-noise analysis. Integrate wireless technologies — BLE, Wi-Fi 6/6E/7, Lo Ra, NB-Io T/LTE-M, 5G, GNSS, UWB and NFC; design and tune PCB / chip antennas for return loss, radiation pattern and MIMO/diversity. Schematic Capture & PCB Layout: Lead schematic capture and PCB layout for motherboards, daughter cards and high-end multi-layer boards with semi-complex routing. Own controlled impedance, microstrip/stripline, via stitching, copper pour, switching-node minimization, return-path optimization and plane partitioning. Specify high-frequency laminates (Rogers, Taconic), stackups, isolation, creepage/clearance and surge/ESD protection. Compliance, Validation & Production: Drive EMI/EMC design per CISPR, FCC Part 15, IEC 61000, IEC 62368; ensure SAR and energy-efficiency compliance (DOE Level VI, Co C Tier 2). Lead regulatory pre-compliance for FCC, CE/RED, IC, TELEC, BIS, WPC and UL. Conduct RF bench testing (VNA, spectrum analyzer, signal generator, anechoic chamber) and OTA/conducted RF testing (EVM, ACPR). Perform power validation with oscilloscopes, electronic loads, power analyzers, LCR meters, EMI receivers/LISN and thermal imaging. Manage component selection, BOM optimization and sourcing with DFM/DFMA awareness; support DVT/EVT/PVT and NPI. Collaborate with firmware and mechanical teams on prototype bring-up; lead design reviews, own documentation and mentor junior engineers. Preferred Skills 5–10 years in hardware engineering with power electronics, RF and mixed-signal high-frequency PCB design experience Hands-on with motherboards, daughter cards and high-end multi-layer boards involving semi-complex routing Proficiency in schematic and PCB tools — Altium Designer, Cadence Or CAD/Allegro or Ki Cad Power simulation — LTspice, PSpice, Simetrix or PLECS; experience with Ga N/Si C-based high-efficiency designs RF simulation — Keysight ADS, Ansys HFSS, CST Studio or AWR Microwave Office; exposure to 5G mm Wave or UWB design Working knowledge of MATLAB/Simulink for RF/system modeling and thermal simulators (Ansys Icepak or equivalent) Experience taking wireless products through full certification cycles; familiarity with EMC standards (FCC/CE) and regulatory workflows Prior work on USB-PD, fast-charging or wireless power products; NPI experience in high-volume consumer, industrial or automotive products Hands-on bring-up, bench debug, RF and high-current measurement experience BOM costing and DFx awareness. Think you might be a fit?